100337-701

Technical Characteristics

• Memory Device Type

  rom

• Operating Temp Range

  -25.0/+70.0 deg celsius

• Terminal Surface Treatment

  solder

• Input Circuit Pattern

  11 input

• Body Length

  1.200 inches minimum and 1.290 inches maximum

• Output Logic Form

  p-type metal oxide-semiconductor logic

• Inclosure Material

  ceramic and glass

• Inclosure Configuration

  dual-in-line

• Body Width

  0.515 inches minimum and 0.580 inches maximum

• Terminal Type And Quantity

  24 printed circuit

• Body Height

  0.050 inches minimum and 0.230 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Capacity

  unknown

• Bit Quantity (Non-Core)

  2048

• Maximum Power Dissipation Rating

  650.0 milliwatts

• Features Provided

  programmable and negative outputs and positive outputs and monolithic and hermetically sealed and programmed and w/enable

• Case Outline Source And Designator

  -0-015-aa joint electron device engineering council

• Test Data Document

  31935-100337 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Voltage Rating And Type Per Characteristic

  -30.0 volts minimum power source and 0.3 volts maximum power source

• Word Quantity (Non-Core)

  256