8Z1140PC3

Technical Characteristics

• Distance From Mounting Hole Center To Mounting End

  0.171 inches

• Material Thickness

  0.125 inches

• Mounting Hole Diameter

  0.138 inches

• Mounting Method Style

  straight one hole

• Overall Length

  0.750 inches

• Surface Treatment

  tin mounting facility single layer

• Mounting Facility Thickness

  0.125 inches

• Overall Width

  0.344 inches

• Material

  copper alloy mounting facility

• Material Document And Classification

  mil-b-13492,-cancelled mil spec single material response conductor accommodation

• Surface Treatment

  tin conductor accommodation single layer

• Material Document And Classification

  mil-b-13492,-cancelled mil spec single material response mounting facility

• Angle

  90.0 degrees

• Conductor Accommodation Type

  solder pot single end

• Material

  copper alloy conductor accommodation

• Electrical Insulation Feature

  uninsulated

• Wire Hole Diameter

  0.093 inches single end

• Mounting Tongue Width

  0.344 inches

• Largest Diameter

  0.250 inches single end

• Basic Shape Style

  solder, angular

• Maximum Conductor Size Accommodated

  12 awg