839-908-X7F0-470K

Technical Characteristics

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Case Material

  glass

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -10.0/+5.0 with rated voltage applied single section

• Capacitance Value Per Section

  47.000 picofarads single section

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Overall Height (Non-Core)

  0.250 inches maximum

• Dissipation Factor At Reference Temp In Percent

  2.5000

• Body Diameter

  0.250 inches maximum

• Body Style

  chip type

• Overall Width (Non-Core)

  0.250 inches maximum

• Overall Length (Non-Core)

  0.025 inches maximum

• Body Length

  0.025 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Nonderated Continuous Voltage Rating And Type Per Section

  250.0 dc single section