1B4-2361B1

Technical Characteristics

• Overall Height

  1.000 inches nominal

• Mounting Facility Quantity

  2

• Internal Configuration

  junction contact all semiconductor device diode

• Electrode Internally-Electrically Connected To Case

  collector

• Mounting Method

  threaded hole

• Features Provided

  hermetically sealed case

• Thread Series Designator

  unc

• Inclosure Material

  glass and metal

• Overall Length

  1.250 inches nominal

• Overall Width

  1.250 inches nominal

• Joint Electronic Device Engineering Council/jedec/case Outline Designation

  d0-1

• Internal Junction Configuration

  pn all semiconductor device diode

• Component Name And Quantity

  4 semiconductor device diode

• Nominal Thread Size

  0.138 inches

• Semiconductor Material

  silicon all semiconductor device diode

• Voltage Rating In Volts Per Characteristic

  2000.0 maximum reverse voltage, peak all semiconductor device diode

• Current Rating Per Characteristic

  70.00 milliamperes maximum forward current, dc all semiconductor device diode

• Maximum Operating Temp Per Measurement Point

  125.0 deg celsius ambient air

• Terminal Type And Quantity

  8 uninsulated wire lead