133-13-11-025

Technical Characteristics

• Accommodated Contact Quantity

  3

• Mounting Hole Style

  round, w/two mounting holes

• Polarization Type

  contact position

• Body Mounting Hole Accommodation Diameter

  0.400 inches nominal

• Specific Equipment Accommodated

  semiconductor device

• Terminal Type And Quantity

  3 tab, solder lug

• Contact Material

  copper alloy

• Mounting Method

  saddle

• Mounting Hole Diameter

  0.101 inches nominal

• Distance Between Mounting Facility Centers

  0.590 inches nominal

• Mounting Type For Which Designed

  chassis

• Fabrication Method

  molded