TX2N6308

Semiconductor Devices and Associated Hardware

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TX2N6308

5961-01-051-8616

5961 - Semiconductor Devices and Associated Hardware

Joint Army-Navy Specifications

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Technical Characteristics

  • ~1

    type data on certain environmental and performa

  • Test Data Document

    81349-mil-prf-19500 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general

  • Power Rating Per Characteristic

    125.0 watts small-signal input power, common-collector preset

  • Overall Length

    1.573 inches maximum

  • Internal Configuration

    junction contact

  • Special Features

    junction pattern arrangement: npn

  • Overall Width

    1.050 inches maximum

  • Semiconductor Material

    silicon

  • Terminal Type And Quantity

    1 case and 2 pin

  • Mounting Facility Quantity

    2

  • Maximum Operating Temp Per Measurement Point

    200.0 deg celsius junction

  • Mounting Method

    unthreaded hole

  • Inclosure Material

    metal

  • Voltage Rating In Volts Per Characteristic

    700.0 maximum collector to base voltage/static/emitter open and 350.0 maximum collector to emitter voltage/static/base open and 8.0 maximum emitter to base voltage, static, collector open

  • Overall Height

    0.450 inches maximum

  • Terminal Length

    0.312 inches minimum

  • Electrode Internally-Electrically Connected To Case

    collector

  • Current Rating Per Characteristic

    4.00 amperes source cutoff current minimum and 8.00 amperes source cutoff current maximum

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