258300-11448

Technical Characteristics

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Style

  chip type

• Body Height

  0.110 inches maximum

• Overall Width (Non-Core)

  0.110 inches nominal

• Tolerance Range Per Section

  -1.00/+1.00 percent single section

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Capacitance Value Per Section

  30.000 picofarads single section

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.110 inches nominal

• Overall Length (Non-Core)

  0.130 inches maximum

• Features Provided

  hermetically sealed case

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Overall Height (Non-Core)

  0.110 inches maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Case Material

  glass

• Body Length

  0.130 inches maximum

• Quality Factor At Reference Temp

  10000.0000