ROM/PROM FAMILY 013

Technical Characteristics

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Inclosure Configuration

  dual-in-line

• Bit Quantity (Non-Core)

  256

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Body Length

  0.840 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Terminal Type And Quantity

  16 printed circuit

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Memory Device Type

  prom

• Maximum Power Dissipation Rating

  739.0 milliwatts

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Input Circuit Pattern

  6 input

• Word Quantity (Non-Core)

  32

• Body Height

  0.185 inches maximum

• Case Outline Source And Designator

  d-2 mil-m-38510

• Features Provided

  burn in and programmed and bipolar and monolithic and schottky

• Operating Temp Range

  -55.0/+125.0 deg celsius