MIL-C-55365/2

Technical Characteristics

• Test Data Document

  81349-mil-c-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Overall Length (Non-Core)

  0.320 inches nominal

• Reliability Failure Rate Level In Percent

  1.0000

• Specification/Standard Data

  81349-mil-c-55365/2 government specification

• Body Style

  chip type

• Body Width

  0.180 inches nominal

• Dc Leakage At Maximum Operating Temp

  88.0 microamperes

• Case Material

  ceramic

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 85.0 deg celsius maximum

• Terminal Type And Quantity

  2 bonding pad

• Body Height

  0.100 inches nominal

• Dc Leakage At Reference Temp

  8.800 microamperes

• Body Length

  0.320 inches nominal

• Reliability Indicator

  established

• Nonderated Continuous Voltage Rating And Type Per Section

  20.0 dc single section

• Terminal Surface Treatment

  solder

• Dissipation Factor At Reference Temp In Percent

  6.0000

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Capacitance Value Per Section

  22.000 microfarads single section

• Terminal Length

  0.050 inches nominal

• Overall Width (Non-Core)

  0.180 inches nominal

• Capacitive Electrode Material

  tantalum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Electrical Polarization

  polarized

• Center To Center Distance Between Terminals Parallel To Length

  0.220 inches nominal

• Overall Height (Non-Core)

  0.100 inches nominal