MP11S11J

Technical Characteristics

• Terminal Surface Treatment

  solder

• Center To Center Distance Between Terminals Parallel To Width

  0.630 inches nominal

• Capacitance Value Per Section

  1.100 microfarads single section

• Reliability Indicator

  not established

• Body Height

  0.875 inches maximum

• Terminal Length

  0.380 inches maximum

• Overall Height (Non-Core)

  0.875 inches maximum

• Distance Between Centerlines Of Mounting Facilities Parallel To Body Length

  2.375 inches nominal

• Body Style

  w/mtg tabs/flanges, terminal(s) on one surface

• Schematic Diagram Designator

  no common or grounded electrode(s)

• End Item Identification

  radar set an/sps-67(v)1

• Nonderated Operating Temp

  0.0 deg celsius minimum and 65.0 deg celsius maximum

• Overall Length (Non-Core)

  2.720 inches nominal

• Overall Width (Non-Core)

  4.470 inches nominal

• Dissipation Factor At Reference Temp In Percent

  0.0050

• Body Length

  1.970 inches nominal

• Unthreaded Mounting Hole Diameter

  0.156 inches nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  2000.0 dc single section

• Body Width

  4.470 inches nominal

• Tolerance Range Per Section

  -5.00/+5.00 percent single section

• Terminal Type And Quantity

  2 solder stud

• Mounting Facility Type And Quantity

  4 unthreaded mounting holes

• Temp Coefficient Of Capacitance Range Per Section In Ppm Per Deg Celsius

  -500.0/+500.0 single section

• Distance Between Centerlines Of Mounting Facilities Parallel To Body Width

  4.063 inches nominal

• Case Material

  plastic

• Insulation Resistance At Reference Temp

  5000.0 megohm-microfarads