BUS23B

Semiconductor Devices and Associated Hardware

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BUS23B

5961-01-239-4505

5961 - Semiconductor Devices and Associated Hardware

Philips Circuit Assemblies

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Technical Characteristics

  • Joint Electronic Device Engineering Council/jedec/case Outline Designation

    to-3

  • Overall Length

    1.573 inches maximum

  • Overall Height

    0.386 inches maximum

  • Internal Configuration

    junction contact

  • Special Features

    junction pattern arrangement: npn

  • Features Provided

    hermetically sealed case

  • Overall Width

    1.050 inches maximum

  • Semiconductor Material

    silicon

  • Transfer Ratio

    9.0 minimum static forward current transfer ratio, common-emitter

  • Current Rating Per Characteristic

    30.00 amperes source cutoff current maximum and 6.00 amperes source cutoff current minimum

  • Power Rating Per Characteristic

    175.0 watts small-signal input power, common-collector absolute

  • Terminal Type And Quantity

    2 pin and 1 case

  • Mounting Facility Quantity

    2

  • Voltage Rating In Volts Per Characteristic

    400.0 maximum collector to emitter voltage/static/base open and 450.0 maximum collector to emitter voltage, dc with specified circuit between base and emitter and 9.0 maximum emitter to base voltage, static, collector open

  • Maximum Operating Temp Per Measurement Point

    150.0 deg celsius junction

  • Mounting Method

    unthreaded hole

  • Inclosure Material

    metal

Certified to
AS6081 Methods

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