X2864BEMB

Technical Characteristics

• Body Length

  0.560 inches maximum

• Body Width

  0.458 inches maximum

• Input Circuit Pattern

  26 input

• Body Height

  0.085 inches maximum

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Terminal Surface Treatment

  solder

• Inclosure Material

  ceramic

• Inclosure Configuration

  leadless flat pack

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Word Quantity (Non-Core)

  8192

• Memory Device Type

  prom

• Terminal Type And Quantity

  32 leadless

• Features Provided

  electrostatic sensitive and monolithic and erasable

• Bit Quantity (Non-Core)

  65536

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Test Data Document

  73030-795073 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Output Logic Form

  n-type metal oxide-semiconductor logic