MIL-C-55681/9

Technical Characteristics

• Overall Width

  2.6 millimeters minimum and 3.0 millimeters maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Tolerance Range Per Section

  -1.00/+1.00 percent single section

• Case Material

  ceramic

• Terminal Type And Quantity

  2 bonding pad

• Overall Height (Non-Core)

  1.8 millimeters maximum

• Overall Length

  3.5 millimeters minimum and 4.0 millimeters maximum

• Reliability Failure Rate Level In Percent

  0.001

• Specification/Standard Data

  81349-mil-c-55681/9 government specification

• Reliability Indicator

  established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Terminal Surface Treatment

  solder

• Terminal Length

  0.2 millimeters minimum and 0.7 millimeters maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Length

  2.9 millimeters minimum and 3.4 millimeters maximum

• Body Width

  2.2 millimeters minimum and 2.7 millimeters maximum

• Body Height

  1.5 millimeters maximum

• Dissipation Factor At Reference Temp In Percent

  0.150

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Capacitance Value Per Section

  3300.000 picofarads single section

• ~1

  data on certain environmental and performanc

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Body Style

  chip type

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section