X28256EMB-25

Technical Characteristics

• Memory Device Type

  rom

• Features Provided

  w/enable and programmable and burn in and hermetically sealed and bidirectional and erasable

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Input Circuit Pattern

  26 input

• Case Outline Source And Designator

  c-12 mil-m-38510

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Terminal Surface Treatment

  solder

• Inclosure Material

  ceramic

• Inclosure Configuration

  leadless flat pack

• Body Width

  0.442 inches minimum and 0.458 inches maximum

• Body Length

  0.540 inches minimum and 0.560 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Word Quantity (Non-Core)

  32768

• Terminal Type And Quantity

  32 leadless

• Time Rating Per Chacteristic

  250.00 nanoseconds maximum propagation delay time, low to high level output and 250.00 nanoseconds maximum propagation delay time, high to low level output

• Bit Quantity (Non-Core)

  262144

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Body Height

  0.060 inches minimum and 0.120 inches maximum

• End Item Identification

  alq-135b