BDX66C

Semiconductor Devices and Associated Hardware

TRANSISTOR

BDX66C

5961-01-305-7664

5961 - Semiconductor Devices and Associated Hardware

Philips Semiconductors Inc

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Technical Characteristics

  • Joint Electronic Device Engineering Council/jedec/case Outline Designation

    to-3

  • Overall Length

    1.573 inches maximum

  • Special Features

    junction pattern arrangement: pnp

  • Features Provided

    hermetically sealed case

  • Overall Width

    1.050 inches maximum

  • Semiconductor Material

    silicon

  • Power Rating Per Characteristic

    150.0 watts small-signal input power, common-collector minimum

  • Terminal Type And Quantity

    2 pin and 1 case

  • Mounting Facility Quantity

    2

  • Transfer Ratio

    1.0 nominal static forward current transfer ratio, common-emitter

  • Internal Configuration

    junction contact-darlington connected

  • Maximum Operating Temp Per Measurement Point

    200.0 deg celsius junction

  • Mounting Method

    unthreaded hole

  • Inclosure Material

    metal

  • Current Rating Per Characteristic

    20.00 amperes source cutoff current maximum

  • Overall Height

    0.450 inches maximum

  • Voltage Rating In Volts Per Characteristic

    120.0 maximum breakdown voltage, collector-to-base, emitter open

Certified to
AS6081 Methods

Implementing Quality Procurement

A rigorous vendor selection process and vendor management system are essential to ensuring quality.
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Supplying Quality Products

We take every measure to ensure that we supply quality, authentic parts including a strict vendor selection process and rigorous product inspections..
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Providing Quality People

Our team of dedicated account managers, procurement professionals and specialized inspectors is the most valuable resource we have.
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