G306381-12

Technical Characteristics

• Test Data Document

  81349-mil-c-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Overall Width

  0.085 inches minimum and 0.115 inches maximum

• Dc Leakage At Reference Temp

  1.000 microamperes

• Case Material

  ceramic

• Body Height

  0.035 inches minimum and 0.065 inches maximum

• Overall Length

  0.185 inches minimum and 0.215 inches maximum

• Terminal Length

  0.025 inches minimum and 0.035 inches maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 85.0 deg celsius maximum

• Specification/Standard Data

  81349-mil-c-55365/4 government specification

• Terminal Type And Quantity

  2 bonding pad

• Body Length

  0.185 inches minimum and 0.215 inches maximum

• Reliability Indicator

  established

• Nonderated Continuous Voltage Rating And Type Per Section

  35.0 dc single section

• Capacitance Value Per Section

  1.500 microfarads single section

• Terminal Surface Treatment

  solder

• Dissipation Factor At Reference Temp In Percent

  6.000

• Body Width

  0.085 inches minimum and 0.115 inches maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Reliability Failure Rate Level In Percent

  0.100

• Capacitive Electrode Material

  tantalum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Electrical Polarization

  polarized

• Overall Height

  0.035 inches minimum and 0.065 inches maximum

• Dc Leakage At Maximum Operating Temp

  10.0 microamperes

• Body Style

  chip type

• ~1

  data on certain environmental and performanc