5962-8751413BXB

Technical Characteristics

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Time Rating Per Chacteristic

  350.00 nanoseconds maximum propagation delay time, low to high level output and 350.00 nanoseconds maximum propagation delay time, high to low level output

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Bit Quantity (Non-Core)

  65312

• Body Length

  1.490 inches maximum

• Body Height

  0.217 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Word Quantity (Non-Core)

  8164

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Input Circuit Pattern

  23 input

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Terminal Type And Quantity

  28 printed circuit

• Case Outline Source And Designator

  d-10 mil-m-38510

• Inclosure Configuration

  dual-in-line

• Voltage Rating And Type Per Characteristic

  -0.3 volts minimum power source and 6.25 volts maximum power source

• Features Provided

  burn in and programmed and electrostatic sensitive and monolithic and erasable