750703-3

Technical Characteristics

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Bit Quantity (Non-Core)

  4096

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Time Rating Per Chacteristic

  250.00 nanoseconds maximum propagation delay time, low to high level output and 250.00 nanoseconds maximum propagation delay time, high to low level output

• Features Provided

  burn in and electrostatic sensitive and programmed and monolithic and ultraviolet erasable

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Case Outline Source And Designator

  d-3 mil-m-38510

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Inclosure Configuration

  dual-in-line

• Input Circuit Pattern

  13 input

• Terminal Type And Quantity

  24 printed circuit

• Word Quantity (Non-Core)

  512

• Body Length

  1.290 inches maximum

• Voltage Rating And Type Per Characteristic

  -0.3 volts maximum power source and 6.0 volts maximum power source

• Body Height

  0.210 inches maximum