MIL-C-55681/1

Technical Characteristics

• Reliability Failure Rate Level In Percent

  0.100

• Body Width

  0.050 inches nominal

• Insulation Resistance At Maximum Operating Temp

  100.0 megohm-microfarads

• Capacitance Value Per Section

  10000.000 picofarads single section

• Voltage Temp Limits Per Section In Percent Capacitance Change

  m15.0/p15.0 with rated voltage applied single section

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Tolerance Range Per Section

  m10.00/p10.00 percent single section

• Insulation Resistance At Reference Temp

  1000.0 megohm-microfarads

• Terminal Surface Treatment

  solder

• Test Data Document

  81349-mil-c-55681 specification

• Body Length

  0.180 inches nominal

• Body Height

  0.022 inches minimum and 0.055 inches maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Nonderated Operating Temp

  m55.0 deg celsius minimum and 125.0 deg celsius maximum

• Case Material

  ceramic

• Dissipation Factor At Reference Temp In Percent

  2.500

• Terminal Type And Quantity

  2 bonding pad

• Specification/Standard Data

  81349-mil-c-55681/1 government specification

• Body Style

  chip type

• Reliability Indicator

  established

• Terminal Length

  0.020 inches nominal