CDR32BP221BKUM

Technical Characteristics

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Body Style

  chip type

• Body Height

  1.600 millimeters maximum

• Case Material

  ceramic

• Tolerance Range Per Section

  -5.00/+5.00 percent single section

• Terminal Type And Quantity

  2 bonding pad

• Overall Width

  1.400 millimeters minimum and 2.100 millimeters maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Capacitance Value Per Section

  220.000 picofarads single section

• Reliability Failure Rate Level In Percent

  0.001

• Overall Height (Non-Core)

  1.600 millimeters maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Terminal Length

  0.300 millimeters minimum and 0.700 millimeters maximum

• Reliability Indicator

  established

• Overall Length

  3.000 millimeters minimum and 4.000 millimeters maximum

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Terminal Surface Treatment

  solder

• Dissipation Factor At Reference Temp In Percent

  0.015

• Body Length

  3.000 millimeters minimum and 4.000 millimeters maximum

• Body Width

  1.400 millimeters minimum and 2.100 millimeters maximum

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Specification/Standard Data

  81394-mil-c-55681/8 government specification