HSMS-2802

Semiconductor Devices and Associated Hardware

SEMICONDUCTOR DEVICE,DIODE

HSMS-2802

5961-01-384-4618

5961 - Semiconductor Devices and Associated Hardware

Hewlett-Packard Co

SEMICONDUCTOR DEVICE,DIODE

ACT NOW! SUBMIT A QUICK QUOTE.

Technical Characteristics

  • Special Features

    lead material is alloy 42; lead finish is tin-lead 60-40 percent; max soldering temp 260 degreees celcius for 5 sec; minimum leas strength is 2 lbs pull

  • Part Name Assigned By Controlling Agency

    surface mount rf schottky barrier diodes

Certified to
AS6081 Methods

Implementing Quality Procurement

A rigorous vendor selection process and vendor management system are essential to ensuring quality.
Read more...

Supplying Quality Products

We take every measure to ensure that we supply quality, authentic parts including a strict vendor selection process and rigorous product inspections..
Read more...

Providing Quality People

Our team of dedicated account managers, procurement professionals and specialized inspectors is the most valuable resource we have.
Read more...