2113740A29

Technical Characteristics

• Overall Length

  2.3 millimeters minimum and 2.7 millimeters maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Dissipation Factor At Reference Temp In Percent

  0.150

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Terminal Length

  0.3 millimeters minimum and 0.7 millimeters maximum

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Body Style

  chip type

• Body Height

  1.3 millimeters maximum

• Body Width

  1.1 millimeters minimum and 1.5 millimeters maximum

• Body Length

  1.8 millimeters minimum and 2.2 millimeters maximum

• Case Material

  ceramic

• Overall Height (Non-Core)

  1.6 millimeters maximum

• Tolerance Range Per Section

  -5.00/+5.00 percent single section

• Terminal Type And Quantity

  2 bonding pad

• Reliability Failure Rate Level In Percent

  0.001

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Reliability Indicator

  established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Capacitance Value Per Section

  10.000 picofarads single section

• Overall Width

  1.4 millimeters minimum and 1.8 millimeters maximum

• Terminal Surface Treatment

  solder