MIL-PRF-55681/1

Technical Characteristics

• Body Style

  chip type

• Capacitance Value Per Section

  2200.000 picofarads single section

• Case Material

  ceramic

• Body Width

  0.050 inches nominal

• Terminal Type And Quantity

  2 bonding pad

• Insulation Resistance At Maximum Operating Temp

  100.0 megohm-microfarads

• Body Height

  0.020 inches minimum and 0.055 inches maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0/+15.0 with rated voltage applied single section

• Reliability Indicator

  established

• Insulation Resistance At Reference Temp

  1000.0 megohm-microfarads

• Body Length

  0.080 inches nominal

• Terminal Surface Treatment

  solder

• Terminal Length

  0.020 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Reliability Failure Rate Level In Percent

  0.100

• Dissipation Factor At Reference Temp In Percent

  0.150

• Schematic Diagram Designator

  no common or grounded electrode(s)