NSN: 5910-00-318-2161

Technical Characteristics

• Dissipation Factor At Reference Temp In Percent

  2.5000

• Body Style

  chip type

• Case Material

  ceramic

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -25.0/+15.0 with rated voltage applied single section

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.230 inches nominal

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Capacitance Value Per Section

  0.470 microfarads single section

• Overall Height (Non-Core)

  0.075 inches nominal

• Tolerance Range Per Section

  -20.00/+20.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Nonderated Continuous Voltage Rating And Type Per Section

  25.0 dc single section

• Overall Width (Non-Core)

  0.230 inches nominal

• Body Length

  0.225 inches nominal

• Overall Length (Non-Core)

  0.225 inches nominal

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Height

  0.075 inches nominal