NSN: 5910-01-064-2355

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Overall Length (Non-Core)

  0.145 inches maximum

• Body Length

  0.145 inches maximum

• Terminal Surface Treatment

  silver

• Precious Material (Non-Core)

  silver

• Body Style

  chip type

• Dissipation Factor At Reference Temp In Percent

  2.5000

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Body Height

  0.070 inches maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -20.00/+20.00 percent single section

• Overall Width (Non-Core)

  0.105 inches maximum

• Reliability Indicator

  not established

• Case Material

  plastic

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -30.0/+30.0 without voltage applied single section

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Body Width

  0.105 inches maximum

• Capacitance Value Per Section

  0.022 microfarads single section

• Overall Height (Non-Core)

  0.070 inches maximum

• Precious Material And Location

  terminal surface silver