NSN: 5910-01-258-1398

Technical Characteristics

• ~1

  data on certain environmental and performanc

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Terminal Type And Quantity

  2 bonding pad

• Specification/standard Data

  81349-mil-c-55681/4 government specification

• Body Height

  0.020 inches minimum and 0.057 inches maximum

• Reliability Indicator

  established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Overall Height

  0.020 inches minimum and 0.057 inches maximum

• Capacitance Value Per Section

  10.000 picofarads single section

• Terminal Surface Treatment

  solder

• Reliability Failure Rate Level In Percent

  0.0100

• Overall Width (Non-Core)

  0.055 inches nominal

• Body Length

  0.055 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Overall Length (Non-Core)

  0.055 inches nominal

• Body Width

  0.055 inches nominal

• Dissipation Factor At Reference Temp In Percent

  0.1500

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Terminal Length

  0.005 inches minimum and 0.020 inches maximum

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Body Style

  chip type

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Tolerance Range Per Section

  -1.00/+1.00 percent single section

• Case Material

  ceramic or glass