NSN: 5910-01-275-6512

Technical Characteristics

• Specification/Standard Data

  81349-mil-c-55365/4 government specification

• Terminal Type And Quantity

  2 bonding pad

• Dc Leakage At Reference Temp

  1.000 microamperes

• Dissipation Factor At Reference Temp In Percent

  6.000

• Capacitive Electrode Material

  tantalum

• Case Material

  ceramic

• Nonderated Operating Temp

  m55.0 deg celsius minimum and 85.0 deg celsius maximum

• Electrical Polarization

  polarized

• Body Height

  0.035 inches minimum and 0.065 inches maximum

• Body Width

  0.035 inches minimum and 0.065 inches maximum

• Overall Width

  0.035 inches minimum and 0.065 inches maximum

• Terminal Length

  0.035 inches minimum and 0.065 inches maximum

• Reliability Failure Rate Level In Percent

  1.000

• Reliability Indicator

  established

• Test Data Document

  81349-mil-c-55365 specification

• Terminal Surface Treatment

  solder

• Tolerance Range Per Section

  m10.00/p10.00 percent single section

• Nonderated Continuous Voltage Rating And Type Per Section

  25.0 dc single section

• Dc Leakage At Maximum Operating Temp

  12.0 microamperes

• Capacitance Value Per Section

  0.680 microfarads single section

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Length

  0.135 inches minimum and 0.165 inches maximum

• Overall Height

  0.035 inches minimum and 0.065 inches maximum

• Overall Length

  0.135 inches minimum and 0.165 inches maximum

• Body Style

  chip type