NSN: 5910-01-313-9783

Technical Characteristics

• Case Material

  ceramic or glass

• Iii Terminal Surface Treatment

  solder

• Manufacturers Code

  81349

• Non-Definitive Government Spec/Std Reference

  mil-c-55681/4

• Specification/Standard Data

  81349-mil-c-55681/4 government specification

• Reliability Indicator

  established

• Reliability Failure Rate Level In Percent

  0.010

• (Non-Core Data) Overall Length

  0.030 inches minimum and 0.080 inches maximum

• Body Height

  0.020 inches minimum and 0.057 inches maximum

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Capacitance Value Per Section

  3.300 picofarads single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Tolerance Range Per Section

  -0.10 to 0.10 picofarads single section

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Dissipation Factor At Reference Temp In Percent

  0.150

• Definitive Government Spec/Std Reference

  cdr12bp3r3abur

• Test Data Document

  81349-mil-c-55681 specification

• Terminal Type And Quantity

  2 bonding pad

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0 to 30.0 single section

• Body Style

  45a chip type

• Terminal Length

  0.005 inches minimum and 0.020 inches maximum

• (Non-Core Data) Overall Height

  0.020 inches minimum and 0.057 inches maximum

• (Non-Core Data) Overall Width

  0.030 inches minimum and 0.080 inches maximum

• Body Length

  0.030 inches minimum and 0.080 inches maximum

• Body Width

  0.030 inches minimum and 0.080 inches maximum