NSN: 5910-01-331-4054

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Test Data Document

  81349-mil-c-55681 specification

• Terminal Surface Treatment

  solder

• Dissipation Factor At Reference Temp In Percent

  0.150

• Case Material

  ceramic

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Capacitance Value Per Section

  3900.000 picofarads single section

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Body Height

  0.020 inches minimum and 0.080 inches maximum

• Terminal Length

  0.010 inches minimum and 0.030 inches maximum

• Overall Length

  0.165 inches minimum and 0.200 inches maximum

• Reliability Indicator

  established

• Specification/Standard Data

  81349-mil-c-55681/2b government specification

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Tolerance Range Per Section

  -5.00 to 5.00 percent single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0 to 30.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Width

  0.235 inches minimum and 0.270 inches maximum

• Body Length

  0.165 inches minimum and 0.200 inches maximum

• Overall Width

  0.235 inches minimum and 0.270 inches maximum

• Overall Height

  0.020 inches minimum and 0.080 inches maximum

• Reliability Failure Rate Level In Percent

  0.001

• Body Style

  45a chip type