NSN: 5910-01-347-2035

Technical Characteristics

• ~1

  data on certain environmental and performanc

• Test Data Document

  81349-mil-c-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Terminal Surface Treatment

  solder

• Reliability Failure Rate Level In Percent

  0.010

• Dissipation Factor At Reference Temp In Percent

  6.000

• Capacitance Value Per Section

  4.700 microfarads single section

• Overall Width

  0.135 inches minimum and 0.165 inches maximum

• Dc Leakage At Maximum Operating Temp

  30.0 microamperes

• Capacitive Electrode Material

  tantalum

• Overall Length

  0.270 inches minimum and 0.300 inches maximum

• Anode Type

  solid

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Electrical Polarization

  polarized

• Body Length

  0.270 inches minimum and 0.300 inches maximum

• Body Width

  0.135 inches minimum and 0.165 inches maximum

• Body Style

  chip type

• Terminal Length

  0.045 inches minimum and 0.055 inches maximum

• Dc Leakage At Reference Temp

  3.000 microamperes

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Case Material

  ceramic

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 85.0 deg celsius maximum

• Tolerance Range Per Section

  -5.00/+5.00 percent single section

• Specification/Standard Data

  81349-mil-c-55365/4 government specification

• Terminal Type And Quantity

  2 bonding pad

• Overall Height

  0.095 inches minimum and 0.125 inches maximum

• Body Height

  0.095 inches minimum and 0.125 inches maximum

• Reliability Indicator

  established