NSN: 5910-01-359-7524

Technical Characteristics

• Test Data Document

  81349-mil-c-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Terminal Length

  0.030 inches nominal

• Body Style

  chip type

• Capacitance Value Per Section

  10.000 microfarads single section

• Dc Leakage At Reference Temp

  1.000 microamperes

• Case Material

  ceramic

• Nonderated Continuous Voltage Rating And Type Per Section

  4.0 dc single section

• Specification/Standard Data

  81349-mil-c-55365/4 government specification

• Terminal Type And Quantity

  2 bonding pad

• Reliability Indicator

  established

• Overall Height (Non-Core)

  0.050 inches nominal

• Overall Width (Non-Core)

  0.100 inches nominal

• Dc Leakage At Maximum Operating Temp

  12.0 microamperes

• Terminal Surface Treatment

  solder

• Body Width

  0.100 inches nominal

• Overall Length (Non-Core)

  0.150 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Reliability Failure Rate Level In Percent

  0.100

• Capacitive Electrode Material

  tantalum

• Anode Type

  solid

• Body Length

  0.150 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Electrical Polarization

  polarized

• Body Height

  0.050 inches nominal