NSN: 5910-01-368-3037

Technical Characteristics

• Body Length

  0.270 inches minimum and 0.300 inches maximum

• Body Style

  chip type

• Case Material

  ceramic

• Specification/Standard Data

  81349-mil-c-55365/4 government specification

• Capacitance Value Per Section

  15.000 microfarads single section

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.095 inches minimum and 0.125 inches maximum

• Reliability Indicator

  established

• Dc Leakage At Maximum Operating Temp

  40.0 microamperes

• Terminal Surface Treatment

  solder

• Reliability Failure Rate Level In Percent

  0.010

• Test Data Document

  81349-mil-c-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Dissipation Factor At Reference Temp In Percent

  6.000

• Dc Leakage At Reference Temp

  4.000 microamperes

• Tolerance Range Per Section

  -20.00/+20.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  25.0 dc single section

• Overall Height

  0.135 inches minimum and 0.165 inches maximum

• Overall Width

  0.095 inches minimum and 0.125 inches maximum

• Capacitive Electrode Material

  tantalum

• Overall Length

  0.270 inches minimum and 0.300 inches maximum

• Anode Type

  solid

• Body Height

  0.135 inches minimum and 0.165 inches maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Special Features

  weibull graded failure rate

• Electrical Polarization

  polarized

• ~1

  data on certain environmental and performanc