NSN: 5910-01-369-8267

Technical Characteristics

• Dissipation Factor At Reference Temp In Percent

  2.500

• Capacitance Value Per Section

  0.100 picofarads single section

• Body Style

  chip type

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Case Material

  ceramic

• Terminal Type And Quantity

  2 bonding pad

• Overall Length (Non-Core)

  0.126 inches nominal

• Body Length

  0.126 inches nominal

• Overall Height (Non-Core)

  0.050 inches nominal

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0/+15.0 without voltage applied single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Body Width

  0.063 inches nominal

• Overall Width (Non-Core)

  0.063 inches nominal

• Terminal Length

  0.010 inches minimum and 0.030 inches maximum

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Height

  0.050 inches nominal