NSN: 5910-01-381-8940

Technical Characteristics

• Specification/standard Data

  81349-mil-c-55681/8 government specification

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -25.0/+15.0 with rated voltage applied single section

• ~1

  data on certain environmental and performanc

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Dissipation Factor At Reference Temp In Percent

  2.500

• Body Style

  chip type

• Body Height

  1.3 millimeters maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Case Material

  ceramic

• Overall Length

  3.0 millimeters minimum and 3.4 millimeters maximum

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  1.4 millimeters minimum and 1.8 millimeters maximum

• Reliability Failure Rate Level In Percent

  0.001

• Reliability Indicator

  established

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Overall Width

  1.4 millimeters minimum and 1.8 millimeters maximum

• Terminal Surface Treatment

  solder

• Overall Height (Non-Core)

  1.3 millimeters maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Body Length

  3.0 millimeters minimum and 3.4 millimeters maximum

• Capacitance Value Per Section

  39000.000 picofarads single section

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Terminal Length

  0.3 millimeters minimum and 0.7 millimeters maximum