NSN: 5910-01-388-9174

Technical Characteristics

• Specification/Standard Data

  81349-mil-c-55681/8 government specification

• Terminal Type And Quantity

  2 bonding pad

• Test Data Document

  81349-mil-c-55681 specification

• Non-Definitive Government Spec/Std Reference

  mil-c-55681/8

• Manufacturers Code

  81349

• Definitive Government Spec/Std Reference

  cdr32bp681bjms

• (Non-Core Data) Precious Material

  palladium and silver

• Iii Terminal Surface Treatment

  palladium and silver

• Dissipation Factor At Reference Temp In Percent

  0.150

• Case Material

  ceramic

• Tolerance Range Per Section

  -5.00 to 5.00 percent single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0 to 30.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Body Length

  3.2 millimeters nominal

• (Non-Core Data) Overall Width

  1.6 millimeters nominal

• Reliability Failure Rate Level In Percent

  0.001

• Reliability Indicator

  established

• Body Style

  45a chip type

• Iii Precious Material And Location

  terminal surfaces palladium and terminal surfaces silver

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Capacitance Value Per Section

  680.000 microfarads single section

• Iii Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Body Height

  1.3 millimeters maximum

• Body Width

  1.6 millimeters nominal

• (Non-Core Data) Overall Height

  1.3 millimeters maximum

• Terminal Length

  0.5 millimeters nominal

• (Non-Core Data) Overall Length

  3.2 millimeters nominal