NSN: 5910-01-407-2518

Technical Characteristics

• Overall Width (Non-Core)

  1.8 millimeters maximum

• Case Material

  ceramic

• Overall Length

  3.0 millimeters minimum and 3.4 millimeters maximum

• Dc Leakage At Maximum Operating Temp

  5.0 microamperes

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 85.0 deg celsius maximum

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  1.8 millimeters maximum

• Reliability Failure Rate Level In Percent

  0.001

• Capacitance Value Per Section

  1.000 microfarads single section

• Reliability Indicator

  established

• Dc Leakage At Reference Temp

  0.500 microamperes

• Terminal Surface Treatment

  solder

• Specification/Standard Data

  81349-mil-c-55365/8 government specification

• Overall Height

  1.4 millimeters minimum and 1.8 millimeters maximum

• Terminal Length

  0.8 millimeters nominal

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Dissipation Factor At Reference Temp In Percent

  4.000

• Equivalent Series Resistance At Reference Temp In Ohms

  15.00

• Body Length

  3.0 millimeters minimum and 3.4 millimeters maximum

• Special Features

  weibull grade failure rate

• Nonderated Continuous Voltage Rating And Type Per Section

  15.0 dc single section

• Capacitive Electrode Material

  tantalum

• Anode Type

  solid

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Electrical Polarization

  polarized

• ~1

  data on certain environmental and performanc

• Body Height

  1.4 millimeters minimum and 1.8 millimeters maximum

• Body Style

  chip type

• Test Data Document

  81349-mil-c-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type