NSN: 5910-01-413-5206

Technical Characteristics

• Specification/Standard Data

  81349-mil-c-55681/1 government specification

• Terminal Type And Quantity

  2 bonding pad

• Test Data Document

  81349-mil-c-55681 specification

• Dissipation Factor At Reference Temp In Percent

  2.500

• Case Material

  ceramic

• Tolerance Range Per Section

  -10.00 to 10.00 percent single section

• Capacitance Value Per Section

  100000.000 picofarads single section

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Body Height

  0.022 inches minimum and 0.055 inches maximum

• (Non-Core Data) Overall Width

  0.035 inches minimum and 0.065 inches maximum

• (Non-Core Data) Overall Height

  0.022 inches minimum and 0.055 inches maximum

• Terminal Length

  0.010 inches minimum and 0.030 inches maximum

• Reliability Indicator

  established

• Iii Insulation Resistance At Maximum Operating Temp

  100.0 megohm-microfarads

• Iii End Item Identification

  6625-01-320-3352 adapter,test

• Body Width

  0.035 inches minimum and 0.065 inches maximum

• Body Length

  0.165 inches minimum and 0.195 inches maximum

• (Non-Core Data) Overall Length

  0.165 inches minimum and 0.195 inches maximum

• Reliability Failure Rate Level In Percent

  0.001

• Body Style

  45a chip type

• Non-Definitive Government Spec/Std Reference

  mil-c-55681/01

• Manufacturers Code

  81349

• Definitive Government Spec/Std Reference

  cdr02bx104akus

• Iii Terminal Surface Treatment

  solder

• Insulation Resistance At Reference Temp

  1000.0 megohm-microfarads

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0 to 15.0 without voltage applied single section