NSN: 5910-01-418-3457

Technical Characteristics

• Test Data Document

  mil-c-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data

• Body Style

  chip type

• Capacitance Value Per Section

  10.000 microfarads single section

• Dc Leakage At Reference Temp

  1.000 microamperes

• Terminal Length

  0.025 inches minimum and 0.035 inches maximum

• Specification/Standard Data

  81349-mil-c-55365/4 government specification

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.095 inches minimum and 0.125 inches maximum

• Body Length

  0.205 inches minimum and 0.235 inches maximum

• Overall Height

  0.095 inches minimum and 0.125 inches maximum

• Body Height

  0.095 inches minimum and 0.125 inches maximum

• Reliability Indicator

  established

• Dissipation Factor At Reference Temp In Percent

  8.000

• Case Material

  plastic

• Terminal Surface Treatment

  solder

• Reliability Failure Rate Level In Percent

  0.010

• Dc Leakage At Maximum Operating Temp

  12.000 microamperes

• Tolerance Range Per Section

  -20.00/+20.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• ~1

  on certain environmental and performance requ

• Nonderated Continuous Voltage Rating And Type Per Section

  15.0 dc single section

• Overall Length

  0.205 inches minimum and 0.235 inches maximum

• Overall Width

  0.095 inches minimum and 0.125 inches maximum

• Capacitive Electrode Material

  tantalum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Electrical Polarization

  polarized