NSN: 5910-01-453-9671

Technical Characteristics

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Body Style

  chip type

• Capacitance Value Per Section

  82000.000 picofarads single section

• Body Height

  1.5 millimeters nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• End Item Identification

  pilot alert

• Case Material

  ceramic

• Terminal Type And Quantity

  2 bonding pad

• Reliability Failure Rate Level In Percent

  0.001

• Nonderated Operating Temp

  55.0 deg celsius minimum and 125.0 deg celsius maximum

• Specification/Standard Data

  81349-mil-c-55681/9 government specification

• Reliability Indicator

  established

• Terminal Surface Treatment

  solder

• Body Width

  2.5 millimeters nominal

• Body Length

  3.2 millimeters nominal

• Tolerance Range Per Section

  -10.00/+10.00 picofarads single section

• Schematic Diagram Designator

  no common or grounded electrode(s)

• ~1

  data on certain environmental and performanc