NSN: 5910-01-459-0680

Technical Characteristics

• Test Data Document

  81349-mil-prf-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general

• ~1

  type data on certain environmental and performa

• Reliability Failure Rate Level In Percent

  1.000

• Dc Leakage At Maximum Operating Temp

  6.0 microamperes

• Body Style

  chip type

• Case Material

  ceramic

• Nonderated Continuous Voltage Rating And Type Per Section

  4.0 dc single section

• Body Length

  0.118 inches minimum and 0.134 inches maximum

• Overall Width

  0.622 inches minimum and 0.638 inches maximum

• Terminal Length

  0.769 inches minimum and 0.831 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Capacitance Value Per Section

  2.200 microfarads single section

• Reliability Indicator

  established

• Dc Leakage At Reference Temp

  0.500 microamperes

• Overall Height

  0.055 inches minimum and 0.071 inches maximum

• Terminal Surface Treatment

  solder

• Dissipation Factor At Reference Temp In Percent

  6.000

• Body Height

  0.055 inches minimum and 0.071 inches maximum

• Tolerance Range Per Section

  -20.00/+20.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Width

  0.055 inches minimum and 0.071 inches maximum

• Specification/Standard Data

  81349-mil-prf-55365/8 government specification

• Capacitive Electrode Material

  tantalum

• Anode Type

  solid

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Electrical Polarization

  polarized

• Overall Length

  0.118 inches minimum and 0.134 inches maximum