NSN: 5910-01-479-3546

Technical Characteristics

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Body Style

  chip type

• Dissipation Factor At Reference Temp In Percent

  0.0500

• Criticality Code Justification

  agav

• Body Width

  0.050 inches nominal

• Terminal Type And Quantity

  2 bonding pad

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Body Height

  0.022 inches nominal

• Reliability Indicator

  established

• Body Length

  0.080 inches nominal

• End Item Identification

  electronic component

• Reliability Failure Rate Level In Percent

  0.0100

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Capacitance Value Per Section

  1800.000 picofarads single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Special Features

  termination finish is base metallization-barrier metal-soldermin thick of 60 micro-inches coated (tin/lead alloy)

• Case Material

  glass or ceramic

• Schematic Diagram Designator

  no common or grounded electrode(s)

• ~1

  data on certain environmental and performanc