NSN: 5910-01-482-0923

Technical Characteristics

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Terminal Type And Quantity

  2 bonding pad

• Case Material

  ceramic or glass

• Capacitance Value Per Section

  33000.000 picofarads single section

• Criticality Code Justification

  agav

• Dissipation Factor At Reference Temp In Percent

  0.0500

• Body Height

  1.3 millimeters maximum

• Body Style

  chip type

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Width

  1.2 millimeters nominal

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Reliability Failure Rate Level In Percent

  0.0100

• End Item Identification

  circuit card assy

• Body Length

  2.0 millimeters nominal

• Reliability Indicator

  established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -15.0/+15.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Terminal Length

  0.5 millimeters nominal

• Special Features

  termination finish is base metallization-barrier metal-solder coated min thick of 60 micro-inches (tin/lead alloy)