NSN: 5910-01-482-0963

Technical Characteristics

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Capacitance Value Per Section

  150000.000 picofarads single section

• Body Style

  chip type

• Body Length

  6.4 millimeters nominal

• Dissipation Factor At Reference Temp In Percent

  0.0500

• Criticality Code Justification

  agav

• Case Material

  ceramic or glass

• Terminal Type And Quantity

  2 bonding pad

• Special Features

  termination finish is base metallization-barrier metal-solder coated min thick of 60 micro-inches (tin/lead alloy)

• Terminal Length

  0.5 millimeters nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -15.0/+15.0 single section

• Reliability Indicator

  established

• End Item Identification

  circuit card assy

• Reliability Failure Rate Level In Percent

  0.0100

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Body Height

  1.5 millimeters maximum

• ~1

  data on certain environmental and performanc

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Width

  4.5 millimeters nominal