NSN: 5910-01-498-9264

Technical Characteristics

• Test Data Document

  81349-mil-prf-55681e specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general

• ~1

  type data on certain environmental and perform

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Dissipation Factor At Reference Temp In Percent

  0.150

• Specification/Standard Data

  81349-mil-prf-55681/8b government specification

• Body Height

  1.300 millimeters maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Reliability Failure Rate Level In Percent

  0.010

• Terminal Surface Treatment

  solder

• Body Width

  1.600 millimeters nominal

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Reliability Indicator

  established

• Terminal Type And Quantity

  2 bonding pad

• Body Length

  3.200 millimeters nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Capacitance Value Per Section

  2200.000 picofarads single section

• Body Style

  chip type

• Schematic Diagram Designator

  no common or grounded electrode(s)