NSN: 5910-01-498-9352

Technical Characteristics

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Reliability Failure Rate Level In Percent

  0.100

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -20.00/+20.00 percent single section

• Capacitance Value Per Section

  10000.000 picofarads single section

• Terminal Surface Treatment

  solder

• Body Length

  0.180 inches nominal

• Reliability Indicator

  established

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0/+15.0 with rated voltage applied single section

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Body Height

  0.022 inches minimum and 0.055 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Specification/Standard Data

  81349-mil-prf-55681/1e government specification

• Body Width

  0.050 inches nominal

• Body Style

  chip type

• Dissipation Factor At Reference Temp In Percent

  2.500

• Test Data Document

  81349-mil-prf-55681e specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general

• ~1

  type data on certain environmental and perform