NSN: 5935-01-008-2437

Technical Characteristics

• Overall Height

  0.624 inches nominal

• Overall Width

  0.328 inches nominal

• Unthreaded Mounting Hole Diameter

  0.125 inches nominal

• Distance Between Mounting Facility Centers

  1.531 inches nominal

• Board Accommodated Width

  0.054 inches minimum and 0.071 inches maximum

• Mating End Quantity

  1

• Contact Removability

  nonremovable

• Contact Surface Treatment

  gold and nickel

• Insert Material

  plastic diallyl phthalate

• Terminal Type

  solder well

• Contact Material Document And Classification

  qq-b-750 fed spec single material response

• Precious Material

  gold

• Overall Length

  1.781 inches nominal

• Board Accommodated Length

  1.078 inches nominal

• Contact Maximum Current Rating In Amps

  5.0

• Polarization Method

  contact to contact polarizing keys

• Terminal Location

  back

• Contact Material

  copper alloy

• Insert Material Document And Classification

  mil-m-14,type sdg mil spec single material response

• Included Contact Quantity

  12

• Included Contact Type

  leaf spring

• Precious Material And Location

  contact surfaces gold

• Precious Material And Weight

  0.012 gold grains,troy