NSN: 5961-01-235-2204

Semiconductor Devices and Associated Hardware

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5961 - Semiconductor Devices and Associated Hardware

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Technical Characteristics

  • Test Data Document

    81349-mil-s-19500 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

  • Mounting Method

    threaded stud

  • Mounting Facility Quantity

    1

  • Nominal Thread Size

    0.190 inches

  • Thread Series Designator

    unf

  • Overall Width Across Flats

    0.437 inches maximum

  • Internal Configuration

    junction contact

  • Overall Length

    0.955 inches maximum

  • Special Features

    junction pattern arrangement: npn

  • Terminal Type And Quantity

    3 tab, solder lug

  • Transfer Ratio

    80.0 minimum static forward current transfer ratio, common-emitter and 240.0 maximum static forward current transfer ratio, common-emitter

  • Current Rating Per Characteristic

    5.00 amperes source cutoff current maximum and 0.50 amperes source cutoff current minimum

  • Semiconductor Material

    silicon

  • Voltage Rating In Volts Per Characteristic

    100.0 maximum breakdown voltage, collector-to-base, emitter open and 80.0 maximum breakdown voltage, collector-to-emitter, base open and 8.0 maximum emitter to base voltage, static, collector open

  • ~1

    data on certain environmental and performanc

  • Power Rating Per Characteristic

    30.0 watts small-signal input power, common-collector preset

  • Inclosure Material

    metal

  • Specification/Standard Data

    81349-mil-s-19500/374 government specification

  • Maximum Operating Temp Per Measurement Point

    200.0 deg celsius junction

  • Features Provided

    hermetically sealed case and quality assurance level s

Certified to
AS6081 Methods

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