NSN: 5962-01-042-2148

Technical Characteristics

• Inclosure Configuration

  flat pack

• Terminal Surface Treatment

  solder

• ~1

  0.00 nanoseconds nominal propagation delay time, high to low level output

• Time Rating Per Chacteristic

  40.00 nanoseconds nominal propagation delay time, low to high level output and 4

• Memory Device Type

  rom

• Test Data Document

  05869-717384 drawing

• Terminal Type And Quantity

  16 flat leads

• Body Length

  0.350 inches minimum and 0.400 inches maximum

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Operating Temp Range

  -0.0/+75.0 deg celsius

• Storage Temp Range

  -65.0/+150.0 deg celsius

• ~1

  med and w/decoded output and w/buffered output and programmable and expandable a

• ~2

  nd wire-or outputs and bipolar

• Inclosure Material

  ceramic and glass

• Features Provided

  monolithic and hermetically sealed and positive outputs and w/enable and program

• Output Logic Form

  transistor-transistor logic

• Input Circuit Pattern

  6 input

• Bit Quantity

  256

• Word Quantity

  32

• Case Outline Source And Designator

  -0-004-ag joint electron device engineering council

• Voltage Rating And Type Per Characteristic

  -1.5 volts maximum power source and 5.5 volts maximum power source

• Unpackaged Unit Weight

  0.4 grams

• Body Width

  0.200 inches minimum and 0.300 inches maximum

• Body Height

  0.008 inches minimum and 0.100 inches maximum