NSN: 5962-01-150-4631
Microcircuits, Electronic
MICROCIRCUIT,LINEAR
- Raytheon Company
 - Raytheon Company
 - Microsemi Corp.-Integrated Products
 - Microsemi Corp.-Integrated Products
 - Microsemi Corp.-Integrated Products
 - Microsemi Corp.-Integrated Products
 - Boeing Company The
 - Northrop Grumman Systems Corporation
 - Ge Aviations Systems Llc
 - Bae Systems Mission Systems Gfa
 - Silicon General Ltd
 
5962 - Microcircuits, Electronic
MICROCIRCUIT,LINEAR
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Technical Characteristics
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Operating Temp Range
-55.0/+125.0 deg celsius
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Design Function And Quantity
1 power supply
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Features Provided
hermetically sealed and burn in and monolithic and w/open collector and w/resistor
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Input Circuit Pattern
4 input
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Body Height
0.185 inches maximum
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Terminal Surface Treatment
tin
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Test Data Document
97953-1a7862 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
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Storage Temp Range
-65.0/+150.0 deg celsius
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Body Length
0.840 inches maximum
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Body Width
0.220 inches minimum and 0.310 inches maximum
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Inclosure Material
ceramic
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Special Features
available in "j" package-16 pin ceramic dip or "l" package-20 pin ceramic leadless chip carrier
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Maximum Power Dissipation Rating
1.0 watts
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Inclosure Configuration
dual-in-line
 
Related Parts by Category
Related Manufacturers
- Raytheon Company
 - Raytheon Company
 - Microsemi Corp.-Integrated Products
 - Microsemi Corp.-Integrated Products
 - Microsemi Corp.-Integrated Products
 - Microsemi Corp.-Integrated Products
 - Boeing Company The
 - Northrop Grumman Systems Corporation
 - Ge Aviations Systems Llc
 - Bae Systems Mission Systems Gfa
 - Silicon General Ltd
 
    
        Certified toAS6081 Methods
    
    
    
    
    
    

    


