NSN: 5962-01-249-0258

Technical Characteristics

• Iii Overall Width

• Iii Overall Width

  1.160 inches maximum

• Maximum Power Dissipation Rating

  -65.0 to 150.0 deg celsius

• Operating Temp Range

  24 flat leads

• Features Provided

  monolithic and

• Features Provided

  programmed and

• Inclosure Configuration

  ceramic

• Memory Device Type

  -55.0 to 125.0 deg celsius

• Test Data Document

  0.800 inches minimum and

• ~1

  100.00 nanoseconds maximum propagation delay time, high to low level output

• ~1

  rom

• Time Rating Per Chacteristic

  100.00 nanoseconds maximum propagation delay time, low to high level output and

• Terminal Type And Quantity

  solder

• Body Length

  0.045 inches minimum and

• Body Width

  0.420 inches maximum

• Body Width

  1.02 watts

• Body Height

  0.090 inches maximum

• Body Height

  0.300 inches minimum and

• Storage Temp Range

  bipolar and

• Features Provided

  96906-mil-std-883 standard

• Features Provided

  schottky

• Inclosure Material

  f-6 mil-m-38510

• Output Logic Form

  transistor-transistor logic

• Input Circuit Pattern

  14 input

• Bit Quantity

  16384

• Word Quantity

  2048

• Case Outline Source And Designator

  0.640 inches maximum

• Terminal Surface Treatment

  flat pack

• Voltage Rating And Type Per Characteristic

  4.5 volts minimum power source and

• Voltage Rating And Type Per Characteristic

  5.5 volts maximum power source